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Minimize space by compact design. |
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Bonding & curing for PCB, electric components, semiconductor chip bonding. |
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Excellent in curing low temperature (under 60℃) (usable at curing product weak at heat) |
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Can check lamp replacement time by hour meter for lamps. |
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Sensor for lamp on/off and other and safety devices are built in. |
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Improve belt tilting phenomenon by adopting special roller. |
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Reduce heat of product surface by adopting special quartz tube. |
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Auto electricity power contorller built in (restrain unnecessary electricity and prolong life time of system) |
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