Camera Module, LCD Bonding

UV Module system UV SYSTEMS
Features
Minimize space by compact design.
Bonding & curing for PCB, electric components, semiconductor chip bonding.
Excellent in curing low temperature (under 60℃) (usable at curing product weak at heat)
Can check lamp replacement time by hour meter for lamps.
Sensor for lamp on/off and other and safety devices are built in.
Improve belt tilting phenomenon by adopting special roller.
Reduce heat of product surface by adopting special quartz tube.
Auto electricity power contorller built in (restrain unnecessary electricity and prolong life time of system)

Dimension
       Length of Conveyor 1,200~4,000mm
       Width of Conveyor 200~400mm
       UV Lamp Q'ty 1~2 (Mercury, Metal Halide)
※ Adjust the height of reflector and simple cleaning of inside of reflector. (Optional)