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Minimize space
by compact design. |
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Bonding & curing for
PCB, electric components, semiconductor chip bonding. |
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Excellent in curing low
temperature (under 60℃) (usable at curing product weak at heat) |
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Can check lamp replacement
time by hour meter for lamps. |
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Sensor for lamp on/off
and other and safety devices are built in. |
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Improve belt tilting phenomenon
by adopting special roller. |
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Reduce heat of product
surface by adopting special quartz tube. |
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Auto electricity power
contorller built in (restrain unnecessary electricity and prolong
life time of system) |